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Qianli 3D BGA Reballing Stencil Platform for Phone X/XS/MAX 11 Pro Max Motherboard Middle Layer Planting Tin Template Plate Net

SKU: GKVU-1712972

$55

Model 2#/Model 3#/Model 1#/

Dispatch:Usually will be shipped in 24 hours
Shipping:Standard Shipping about 10-25 business days
Secure Payment:Paypal,VISA,MasterCard

Description
QianLi 3 IN 1 phone Middle Frame Reballing Platform for phone X XS MAX 11 11 Pro 11 Pro Max motherboard soldering tool, QianLi phone Middle Frame Reballing Platform for phone X XS MAX 11 11 Pro 11 Pro Max logic board dissembling and assembling testing tool.
QianLi Middle Frame Reballing Platform for phone X XS MAX 11 11 Pro 11 Pro Max SeparatingFeatures
Stencils won’t deform under high temperature.
Featured material.
Strong Magnetic attraction.
Precise positioning.
Efficiency Improvement.
Unique design.
Durable.
Package Included
1 x Qianli 3D BGA Reballing Stencil Platform

Weight 0.1 kg

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