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Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball

SKU: GKVU-1235960

$12

Dispatch:Usually will be shipped in 24 hours
Shipping:Standard Shipping about 10-25 business days
Secure Payment:Paypal,VISA,MasterCard

Features
Efficient:quick alignment for operating of reballing
Easy:positioning pins for precise alignment
Durable:Long Time Operating and Usage Lifetime
Application Model:iphone 6s Plus, 6s
Function:Repairing or fixing problem of iphone 6s Plus 6s processor
Package includes
1 x BGA Reballing Stencils for iPhone 6s/6SP

Weight 0.008 kg

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