Japan Steel Phone Logic Board BGA Repair Stencil Tool for iPhone 7 7P Motherboard IC Chip Ball Soldering
$12
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Features
Efficient:quick alignment for operating of reballing
Easy:positioning pins for precise alignment
Durable:Long Time Operating and Usage Lifetime
Application Model:iphone 7, 7P.
Function:Repairing or fixing problem of iphone 7 7P processor.
Package includes
1 x BGA Reballing Stencils for iPhone 7/7P
| Weight | 0.007 kg |
|---|
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