W101 20Pcs Mobile Phone BGA IC Chip Repair Blades Kit CPU Repair Remover Blade Cutter

Features
This blade adopts imported Japanese full soft SK5 super thin silicon manganese alloy sheet, which has heat resistance, low temperature resistance, oxidation resistance, corrosion resistance, good abrasion resistance and strong toughness.
It solves many problems such as inelasticity, rust, bending and so on.Specifications
Model:W101
Material:Silicon Manganese Alloy
Specification:200 x 145 x 15mm/7.87 x 5.71 x 0.59inch
Weight:265g
Product uses
No.1:Dismantle all kinds of black glue small chips, do not drop point.
No.2:Remove 6S power supply IC all kinds of glass IC, do not hurt glass, do not drop point, no risk.
No.3:The CPU WIFI template with no risk will not drop.
No.4:Remove CPU upper level air, no risk
No.5:Remove all kinds of glass IC, do not hurt the glass, do not drop point, no risk.
No.6:A4-A9CPU is not risk-free. There is no risk to remove all CPU.
No.7:Dismantle A8 A9 CPU
No.8:Remove all kinds of chips, scrape oil and scrape tin, soft knife does not hurt tin point.
No.9:Scraping tin knife, scraping baseband and other chips, once and then, without repeated repeated scraping.
No.10:Widening tin scraper, scraping CPU once, can not repeat repeated scraping.
Using method and principle:first, clean the edge glue of the lower knife position and the black glue around the chip when the chip is disassembled.
Packag Included
10 x IC Chip Repair Blades
10 x Handle