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S500 3D BGA Reballing Stencil CPU Logic Module BGA Reballing Repair Tool for iPhone 5 5S 6 6S 7G 7Plus 8 8P

SKU: GKVU-1463045

$18

Type A11 CPU/Type A10 CPU/Type A9 CPU/Type A8 CPU/Type A7 CPU/

Dispatch:Usually will be shipped in 24 hours
Shipping:Standard Shipping about 10-25 business days
Secure Payment:Paypal,VISA,MasterCard

Features
3D laser square hole BGA reballing stencil template.
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented iphone X Middle Layer Motherboard for iPhone X Middle layer motherboard.
Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.
Specification
Type:A7 CPU / A8 CPU / A9 CPU / A10 CPU / A11 CPU
Package included
1 x BGA Reballing Tool

Weight 0.02 kg

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