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Qianli S400 3D BGA Reballing Stencil Power Logic Module BGA Reballing Repair Tool for iOS 5 5S 6 6S 7G 7Plus 8 8P

SKU: GKVU-1463044

$17

Type for iPHone 8/8p/Type for iPHone 7/7p/Type for iPHone 6s/6sp/Type for iPHone 6/6p/

Dispatch:Usually will be shipped in 24 hours
Shipping:Standard Shipping about 10-25 business days
Secure Payment:Paypal,VISA,MasterCard

Features
3D laser square hole BGA reballing stencil template.
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented phone X Middle Layer Motherboard for Phone X Middle layer motherboard.
Assisting professionals to do Phone X BGA reballing in the most convenient and safest way.
Specification
Type:for PHone 8/8p / for PHone 7/7p / for PHone 6s/6sp / for PHone 6/6p
Package included
1 x BGA Reballing Tool

Weight 0.02 kg

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