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JCD 50g Solder Paste Mild Rosin Environmental Soldering Paste Flux PCB IC Parts Welding Soldering Gel Tool for Metalworking

SKU: GKVU-1697485

$11

Type A (2.00)/Type B/

Dispatch:Usually will be shipped in 24 hours
Shipping:Standard Shipping about 10-25 business days
Secure Payment:Paypal,VISA,MasterCard

Features
Excellent capacity of solder-stickiness.
Excellent Anti-wet Capacity.
Widely used on BGA, PGA, CSP packages and flip chip operation.
Suitable for multiple PCB reflow.
No-clean and Lead free for environmental protection.
Specification
FLUX Type:RMA-625A
Volume:10cc
Weight:50g
Quantity:1Pce
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Package Included
1 x JCD 50g Solder Paste

Weight 0.05 kg

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