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Kaisi K-338 Solder Flux BGA PCB No-Clean Solder Paste Welding Advanced Flux No corrosion 10cc Soldering Repair Paste

SKU: GKVU-1736008

$14

Quantity 1pcs/Quantity 2pcs/

Dispatch:Usually will be shipped in 24 hours
Shipping:Standard Shipping about 10-25 business days
Secure Payment:Paypal,VISA,MasterCard

Features
Excellent solder adhesion
Excellent moisture resistance
Widely used in BGA, PGA, CSP packaging and flip chip operation
Suitable for multiple PCB reflow
No cleaning, no lead, environmental protection, no corrosion
It can be used for rework, ball or pin connection to BGA, PGA and CSP packages, and assembly operations such as flip chip connection to PWB substrates. This is an indispensable and useful tool in the BGA re-aggregation.
Specification
Name:Kaisi K-338
Ingredients:ALPHA Flux
Volume:10cc
Package Included
1 (OR 2) x Kaisi K-338 Solder Flux

Weight 0.075 kg

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