SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Pulp
$21
Shipping:Standard Shipping about 10-25 business days
Secure Payment:Paypal,VISA,MasterCard
Features
High density, high impedance
Pure alloy compositin
Fine and sticky
Stannum planting, not bubbing
Silver containing highlight
Model:SP-X
Weight:50g
Size:38 x 31 x 35mm
Melting Point:158℃
Package Included
1 x SP-X Middle Layer of BGA Motherboard Special Solder Paste
| Weight | 0.05 kg |
|---|
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